Products

Wafer Transfer Robot

Back and forth (X-axis), swivel (θ-axis), up-and-down (Z-axis) + hand rotation (0 to 180°) operations are possible, supporting wafer transfer in the atmosphere. The drive motor is an AC servomotor with absolute encoder specifications for all axes.

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Wafer Cassette Changer

This equipment is a system that replaces the dicing frame for 200mm and 300mm stored in a specified cassette with a standard cassette. The cassettes used are 6-sheet cassettes and 13-sheet cassettes. Each cassette is supplied to the stage by an operator.

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Wafer Transfer Equipment

300mm wafers are transported one by one to cassettes (containers) A to B.
Compatible cassettes (containers) are FOUP, FOSB, OPEN, and PFA. The standard transport is in units of 1 sheet, but transport in units of 5 or 25 sheets is also available.

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EFEM & SORTER

Equipped with a high-performance AC servo motor, it achieves high-speed transfer with ample payload capacity. Robots, load ports, and hands can be arranged optimally; we have inherited over 20 years of robot technology operating in harsh environments.

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Automatic Wafer Demounter

This is a device that separates the wafer from the plate jig (beam) after wire sawing (slicing). This is a fully automated system that performs rough cleaning, separates wafers from plate jigs (beams), single-wafer cleaning, and wafer cassette storage.

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Pick Up Technology

Semiconductor Manufacturing Process

Semiconductor devices are built up by repeating microfabrication technology on high-purity single-crystal structure silicon substrates called wafers. As a specialized manufacturer of in-process wafer transfer equipment, inter-process wafer transfer equipment, and stocker transfer equipment for semiconductor manufacturing equipment, PHT supports the manufacturing process of 300mm wafers for advanced devices and 200mm wafers for IoT and automotive applications.

Production Processes

Semiconductor equipment production process

In semiconductor manufacturing, it is a process of manufacturing equipment production process. PHT utilizes top-level robot technology to produce semiconductor manufacturing equipment and deliver it to top manufacturers. Since the robot has a wafer mapping function, it is possible to detect the presence of wafers on the OPEN carrier side. Even equipment that has been in operation for over 20 years is operating normally, with no metal contamination or increase in particles. It supports the advancement of semiconductor functionality and performance.

Equipment Production Processes

Energy Saving Semiconductor Technology

PHT Inc., which has the world's top market share for automatic wafer delamination equipment, has utilized silicon wafer transport and laser processing technology to deliver next-generation SiC (silicon carbide) and GaN (gallium nitride) materials, as well as transport solutions (robots) for compound semiconductors. ・Conveyor (conveyor or transfer equipment, EFEM, SORTER, automatic peeling/cleaning equipment, cleaning equipment) is proposed, and we are actively approaching the power semiconductor market in particular. PHT has created a system to provide comprehensive solutions for semiconductor manufacturing equipment for energy conservation (electric vehicles, power control).

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