This is an automatic wafer peeling device after wire sawing (slicing). By setting the ingot bonded to the plate jig on the loading side, this system fully automates the process from rough cleaning to wafer peeling to wafer single wafer cleaning to drying to cassette storage. After peeling, the plate jig is discharged to the unloader side.
Peeling is done one by one by hot air heating method. Wafers after delamination are cleaned using the single-wafer method. After 2-fluid high-pressure washing, scrubbing, rinsing, water absorption roller drying, and slit nozzle drying, the horizontal articulated robot stores each sheet in the unloader's cassette. Storage can be selected from the upper and lower stages of the cassette (25 pieces). The maximum number of storage cassettes is 6. Supports OHT transportation.
